• Restrict connector materials to copper and copper alloys.
• Connector body plating of silver or white bronze with a minimum plating thickness of 6u m (0.0002 in.).
• Avoid use of stainless, nickel, or ferrite in signal path.
• Quality machining - minimum finish of .4 mm.
• Properly designed interface at connect, panel, and contact surfaces.
• Avoid crimp connections - all connections should be soldered. Clamp and solder outer contacts for best static and dynamic performance.
• DIN connectors are less susceptible to Intermodulation than N connectors.
• Avoid hermetic seals containing Kovar.